vsmy2850rg, vsmy2850g www.vishay.com vishay semiconductors rev. 1.2, 04-aug-11 1 document number: 83398 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 high speed infrared emitting diodes, 850 nm, surface emitter technology description vsmy2850 series are infrared, 850 nm emitting diodes based on gaalas su rface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in clear, untinte d plastic packages (with lens) for surface mounting (smd). applications ? irda compatible data transmission ? miniature light barrier ? photointerrupters ? optical switch ? emitter source for proximity sensors ? ir touch panels ? ir illumination features ? package type: surface mount ? package form: gw, rgw ? dimensions (l x w x h in mm): 2.3 x 2.3 x 2.8 ? peak wavelength: ? p = 850 nm ? high reliability ? high radiant power ? very high radiant intensity ? angle of half intensity: ? = 10 ? suitable for high pulse current operation ? terminal configurations: gu llwing or reverse gullwing ? package matches with de tector vemd2500x01 series ? floor life: 4 weeks, msl 2a, acc. j-std-020 ? compliant to rohs directive 2002/95/ec and in accordance to weee 2002/96/ec ? halogen-free according to iec 61249-2-21 definition note ** please see document vishay material category policy: www.vishay.com/doc?99902 note ? test conditions see table basic characteristics note ? moq: minimum order quantity 21725-5 21 7 2 5-5 vsmy2850rgx01 vsmy2850gx01 product summary component i e (mw/sr) ? (deg) ? p (nm) t r (ns) vsmy2850rg 100 10 850 10 vsmy2850g 100 10 850 10 ordering information ordering code packaging remarks package form vsmy2850rg tape and reel moq: 6000 pcs, 6000 pcs/reel re verse gullwing vsmy2850g tape and reel moq: 6000 pcs, 6000 pcs/reel gullwing
vsmy2850rg, vsmy2850g www.vishay.com vishay semiconductors rev. 1.2, 04-aug-11 2 document number: 83398 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 1 - power dissipation limit vs. ambient temperature fig. 2 - forward current limit vs. ambient temperature absolute maximum ratings (t amb = 25 c, unless otherwise specified) parameter test condition symbol value unit reverse voltage v r 5v forward current i f 100 ma peak forward current t p /t = 0.5, t p ? 100 s i fm 200 ma surge forward current t p = 100 s i fsm 1a power dissipation p v 190 mw junction temperature t j 100 c operating temperature range t amb - 40 to + 85 c storage temperature range t stg - 40 to + 100 c soldering temperature acc. figure 7, j-std-020 t sd 260 c thermal resistance junction/ambie nt j-std-051, soldered on pcb r thja 250 k/w 0 20 40 60 80 100 120 140 160 180 200 0 102030405060708090100 21890 t amb - ambient temperature (c) p v - power dissipation (mw) r thja = 250 k/w 0 20 40 60 80 100 120 0 10 203040 50607080 90100 21891 r thja = 250 k/w t amb - ambient temperature (c) i f - forward current (ma) basic characteristics (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit forward voltage i f = 100 ma, t p = 20 ms v f 1.65 1.9 v i f = 1 a, t p = 100 s v f 2.9 v temperature coefficient of v f i f = 1 ma tk vf - 1.45 mv/k i f = 10 ma tk vf - 1.3 mv/k reverse current i r not designed for reverse operation a junction capacitance v r = 0 v, f = 1 mhz, e = 0 mw/cm 2 c j 125 pf radiant intensity i f = 100 ma, t p = 20 ms i e 50 100 150 mw/sr i f = 1 a, t p = 100 s i e 850 mw/sr radiant power i f = 100 ma, t p = 20 ms ? e 55 mw temperature coefficient of radiant power i f = 100 ma tk ? e - 0.35 %/k angle of half intensity ? 10 deg peak wavelength i f = 100 ma ? p 840 850 870 nm spectral bandwidth i f = 30 ma ?? 30 nm temperature coefficient of ? p i f = 30 ma tk ? p 0.25 nm/k rise time i f = 100 ma, 20 % to 80 % t r 10 ns fall time i f = 100 ma, 20 % to 80 % t f 10 ns virtual source diameter d 1.5 mm
vsmy2850rg, vsmy2850g www.vishay.com vishay semiconductors rev. 1.2, 04-aug-11 3 document number: 83398 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 basic characteristics (t amb = 25 c, unless otherwise specified) fig. 3 - forward current vs. forward voltage fig. 4 - radiant intensity vs. forward current fig. 5 - relative radi ant power vs. wavelength fig. 6 - relative radiant in tensity vs. angular displacement solder profile fig. 7 - lead (pb)-free reflow solder profile acc. j-std-020 drypack devices are packed in moisture barrier bags (mbb) to prevent the products from moisture absorption during transportation and storage. each bag contains a desiccant. floor life floor life (time between soldering and removing from mbb) must not exceed the time indicated on mbb label: floor life: 4 weeks conditions: t amb < 30 c, rh < 60 % moisture sensitivity leve l 2a, acc. to j-std-020. drying in case of moisture absorpti on devices should be baked before soldering. conditions see j-std-020 or label. devices taped on reel dry using recommended conditions 192 h at 40 c (+ 5 c), rh < 5 %. v f - forward voltage (v) 22097 i f - forward current (a) 0.001 0.01 0.1 1 10 0 0.5 1 1.5 2 2.5 3 3.5 t p = 100 s 22098 i f - forward current (a) i e - radiant intensity (mw/sr) 1 10 100 1000 0.001 0.01 0.1 1 t p = 100 s - wavelength (nm) 21776-1 e, rel - relative radiant power 0 0.25 0.5 0.75 1 650 750 850 950 i f = 30 ma 21111 0.6 0 0.2 0.4 0.9 0.8 0 30 10 20 40 50 60 70 80 0.7 1.0 i e rel - relative radiant intensity ? - angular displacement 0 50 100 150 200 250 300 0 50 100 150 200 250 300 time (s) temperature (c) 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 30 s max. ramp up 3 c/s max. ramp down 6 c/s 19841 255 c
vsmy2850rg, vsmy2850g www.vishay.com vishay semiconductors rev. 1.2, 04-aug-11 4 document number: 83398 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters: vsmy2850rg 2.2 5.8 0.2 2.77 0.2 2.3 0.2 cathode 0.5 0.05 0.1 0.254 1.1 0.1 anode 0.4 2.2 0.19 0.3 1.6 0.4 ? 1.8 0.1 2.3 0.2 s pecification s according to din technical drawing s not indicated tolerance s 0.1 drawing-no.: 6.544-5391.03-4 pin id expo s ed copper i ss ue: 1; 18.03.10 22100 0.75 6.7 1.7 ? 2.3 0.1 s older pad propo s al acc. ipc 7351 z z 20:1
vsmy2850rg, vsmy2850g www.vishay.com vishay semiconductors rev. 1.2, 04-aug-11 5 document number: 83398 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters: vsmy2850g 2.2 4.2 0.2 2.77 0.2 2.3 0.2 cathode 0.5 0.05 0.254 0.6 anode 0.4 2.2 0.19 0.3 1.6 0.4 ? 1.8 2.3 0.2 s pecification s according to din technical drawing s not indicated tolerance s 0.1 drawing-no.: 6.544-5383.03-4 i ss ue: 1; 18.03.10 22099 expo s ed copper pin id 0.75 2.45 5.15 s older pad propo s al acc. ipc 7351 x x 20:1
vsmy2850rg, vsmy2850g www.vishay.com vishay semiconductors rev. 1.2, 04-aug-11 6 document number: 83398 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 taping and reel dimensions in millimeters : vsmy2850rg issue: 2; 18.03.10 drawing-no.: 9.800-5100.01-4 leader and trailer tape: parts mounted empty (400 mm min.) empty (160 mm min.) direction of pulling out unreel direction ? 62 0.5 ? 330 1 reel 2 . 5 0.5 label posted here coming out from reel tape position x ? 1 3 0.5 12.4 1.5 x 2:1 i ii 6000 pcs/reel 12 0.3 5.5 0.05 1.75 0.1 2 0.05 4 0.1 4 0.1 ? 1.55 0.05 3.05 0.1 21572 technical drawings according to din specifications terminal position in tape devicce vemd2000 vemd2500 cathode anode anode cathode vsmb2000 vsmg2000 vsmy2850rg vemt2000 vemt2500 collector emitter lead i lead ii
vsmy2850rg, vsmy2850g www.vishay.com vishay semiconductors rev. 1.2, 04-aug-11 7 document number: 83398 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 taping and reel dimensions in millimeters : vsmy2850g drawing-no.: 9.800-5091.01-4 leader and trailer tape: parts mounted empty (400 mm min.) empty (160 mm min.) direction of pulling out unreel direction ? 62 0.5 ? 330 1 reel 2 . 5 0.5 label posted here coming out from reel tape position x ? 13 0.5 12.4 1.5 x 2:1 i ii 6000 pcs/reel 12 0.3 5.5 0.05 1.75 0.1 2 0.05 4 0.1 4 0.1 ? 1.55 0.05 3.05 0.1 21571 technical drawings according to din specifications issue: 3; 18.03.10 terminal position in tape devicce vsmb2020 vsmg2020 cathode anode anode cathode vemd2020 vemd2520 vsmy2850g vemt2020 vemt2520 collector emitter lead i lead ii
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